AS&R Circuits India Pvt. Ltd. is a Total Solutions Provider for the PCB Industry, capable of delivering advanced technology to virtually every industry sector in quantities ranging from quick prototypes to large volume production.
Founded in 1988, American Standard Circuits is a leading manufacturer of advanced circuit board solutions worldwide.
Our ongoing commitment to leading-edge higher level interconnect technology, cost-effective manufacturing and unparalleled customer service has put us at the forefront of advanced technology circuit board fabrication.
We manufacture quality rigid, metal-backed and flex printed circuit boards on various types of substrates for a variety of applications,
| Item | Standard | Advance |
|---|---|---|
| Layer Counts | 1-12 Layers | 12-56 Layers |
| Final Board Thickness | 0.4-3.2 mm | 0.2-7.0 mm |
| Max. Panel Size | 508mm*640mm | 610mm*1400mm |
| Available Laminate Material | CEM-3, FR-4 (High TG,High CTI,Halogen Free,High Frequency), PET, Ceramic Base, Metal Core Flex cyanate Easter & Polyamide, All Rogers, Duroid,Arlon, Fantonic, Neltech & Special Materials | |
| Surface finish | HASL, LF-HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold | |
| Impedance Control | 10% ohm | 5% ohm |
| Min. Line Width/Space | 3/3 mil | 3/ 2.5mil |
| Max Aspect Ratio | 10:1 | 30:1 |
| Copper Thickness | Standard: 18um, 35um,70um,105um | 140um(inner layer)- 280um(outer Layer) |
| Min. finished hole size | 0.2mm | 0.1mm |
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Item |
Flex PCB |
Rigid-Flex PCB |
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Material |
PI,PET,PEN |
PI+FR4+Special Materials |
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Layers |
1-18 |
2-22 |
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Base Copper Thickness |
1/4 -2OZ |
1/4-2OZ for flex, 1/4-4OZ for rigid |
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Board Thickness(Min) |
Single Sided |
0.05mm |
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Double Sided |
0.10mm |
0.20mm |
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Board Dimension(Max) |
500mm x 800mm |
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Width/Space(Min) |
Copper weight upto 0.5OZ |
0.06mm |
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Copper weight upto 0.5-1OZ |
0.075mm |
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Copper weight over 1OZ |
0.10mm |
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Via Type |
Through hole, Blind, Buried |
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Silkscreen Width/Space(Min) |
0.10mm |
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Solder Mask Bridge(Min) |
0.20mm for coverly, 0.12mm for LPI |
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Hole(Min) |
Drill |
0.15mm |
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Punching |
0.5mm |
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Slot(Min) |
0.5mm(punching), 0.8mm(Routing) |
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Dimension Tolerance |
Line Width |
0.03mm(W<=0.3mm, 10%(W>0.3mm) |
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Hole |
+0.05mm(NPTH) |
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+0.05mm(PTH) |
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Outline |
+0.10mm, Special +0.05mm with high precise hard tool |
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Conductor to Outline |
+0.10mm, Special +0.05mm with high precise hard tool |
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Surface Treatment |
Electroless Nickel Immersion Gold (ENIG) |
Ni: 2-6um(80-240um”) Au:0.05-0.10um(2-4u”) |
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Ni/Au Platting |
Ni: 2-8um(80-320u”) Au:0.05-2um(2-80u”) |
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Tin Platting |
5-20um |
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Immersion Silver |
0.1-0.4um |
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Immersion Tin |
0.5-1.5um |
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OSP |
0.2um min |
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Hard gold |
Hardness over 150 HV |
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